Methods
Types
AcCVD
Other
 Processes
 

LPPE - AcCVD
(Low Pressure Plasma Enhanced)
(Activation Chemical Vapour Deposition)

SUB-PROCESSES
GAS
FINAL PRODUCT
Carrier
of Reaction
       
  Excitation      
Chemical sputtering
Ablation
Incision-carving
Cleaning		 Etching
(Acquaforte)
 Ar  

By hitting physically against the surface it removes eventual impurities
  H2
O2		 hydrogen
oxygen		 By binding chemically with other atoms or molecules on the surface
it produces a gas which is being pumped away
Ar
Ar		 H2
O2		 hydrogen
oxygen		 The two effects are combined
Breaking of molecular bonds
Grafting of functional groups

Grafting
(Innesto)

   O2
N2		 oxygen
nitrogen		 By binding chemically with other atoms or molecules on the surface
it produces a new surface, different from the original one.
For example in a molecule, it substitutes the H-link with an OH-link.
Tuning Work Function TWF        

 

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