Methods
Types
AcCVD
Processes
 

LPPE - AcCVD
(Low Pressure Plasma Enhanced)
(Activation Chemical Vapour Deposition)

SUB-PROCESSES

GAS
FINAL PRODUCT
Carrier
of Reaction
       
  Excitation      
Chemical sputtering
Ablation
Incision-carving
Cleaning
Etching
(Acquaforte)
Ar  

By hitting physically against the surface it removes eventual impurities

  H2
O2
hydrogen
oxygen
By binding chemically with other atoms or molecules on the surface
it produces a gas which is being pumped away
Ar
Ar
H2
O2
hydrogen
oxygen
The two effects are combined
Breaking of molecular bonds
Grafting of functional groups

Grafting
(Innesto)

  O2
N2
oxygen
nitrogen
By binding chemically with other atoms or molecules on the surface
it produces a new surface, different from the original one.
For example in a molecule, it substitutes the H-link with an OH-link.
Tuning Work Function TWF        

 

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